JPS6248385B2 - - Google Patents

Info

Publication number
JPS6248385B2
JPS6248385B2 JP15373380A JP15373380A JPS6248385B2 JP S6248385 B2 JPS6248385 B2 JP S6248385B2 JP 15373380 A JP15373380 A JP 15373380A JP 15373380 A JP15373380 A JP 15373380A JP S6248385 B2 JPS6248385 B2 JP S6248385B2
Authority
JP
Japan
Prior art keywords
annular groove
case
metal substrate
resin
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15373380A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5778157A (en
Inventor
Makoto Okazaki
Noritoshi Kotsuji
Toshiki Kurosu
Yoichi Nakajima
Tatsuo Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Minebea Power Semiconductor Device Inc
Original Assignee
Hitachi Ltd
Hitachi Haramachi Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Haramachi Electronics Ltd filed Critical Hitachi Ltd
Priority to JP15373380A priority Critical patent/JPS5778157A/ja
Publication of JPS5778157A publication Critical patent/JPS5778157A/ja
Publication of JPS6248385B2 publication Critical patent/JPS6248385B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP15373380A 1980-11-04 1980-11-04 Resin-sealed semiconductor device Granted JPS5778157A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15373380A JPS5778157A (en) 1980-11-04 1980-11-04 Resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15373380A JPS5778157A (en) 1980-11-04 1980-11-04 Resin-sealed semiconductor device

Publications (2)

Publication Number Publication Date
JPS5778157A JPS5778157A (en) 1982-05-15
JPS6248385B2 true JPS6248385B2 (en]) 1987-10-13

Family

ID=15568901

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15373380A Granted JPS5778157A (en) 1980-11-04 1980-11-04 Resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS5778157A (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0169587U (en]) * 1987-10-30 1989-05-09

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0169587U (en]) * 1987-10-30 1989-05-09

Also Published As

Publication number Publication date
JPS5778157A (en) 1982-05-15

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